Polyplastics co., ltd. private company information – bloomberg electricity quizlet

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Polyplastics Co., Ltd. manufactures and sells various types of engineering plastics and polymers. Its products include acetal copolymer, polybutylene terephthalate, fiberglass reinforced polyethylene terephthalate, liquid crystal polymer, polyphenylene sulfide, and cyclic olefin copolymer. The company, through its subsidiaries, provides sales, marketing, application development, and technical assistance. Its products are used in various application in industries, such as water usage, automotive, electronic equipment, household appliance, and other industries in Japan, the United States, Mexico, Europe, Korea, and internationally. The company was founded in 1962 and is based in Tokyo, Japan w…

Polyplastics Co., Ltd. manufactures and sells various types of engineering plastics and polymers. Its products include acetal copolymer, polybutylene terephthalate, fiberglass reinforced polyethylene terephthalate, liquid crystal polymer, polyphenylene sulfide, and cyclic olefin copolymer. The company, through its subsidiaries, provides sales, marketing, application development, and technical assistance. Its products are used in various application in industries, such as water usage, automotive, electronic equipment, household appliance, and other industries in Japan, the United States, Mexico, Europe, Korea, and internationally. The company was founded in 1962 and is based in Tokyo, Japan with an additional office in Mexico City. It has a subsidiary in Farmington Hills, Michigan. The company has laboratories in Shizuoka, Japan; Kaohsiung City, Taiwan; Shanghai, China; and Pathum Thani, Thailand. It also has plants in Shizuoka and Ehime, Japan; Kaohsiung City, Taiwan; Jiangsu Province, China; Pahang, Malaysia; and Germany. Polyplastics Co., Ltd. operates as a subsidiary of Daicel Corporation.

Polyplastics Co., Ltd. has developed an innovative technology that improves metal-resin bonding of composite parts for the automotive and electrical/electronics industries. Direct metal-resin bonding is a process which uses metal insert molding. Metal parts and resins are firmly bonded by introducing molten resin through injection molding to metal parts which have already undergone sufficient surface treatment. Metal-resin composites deliver the properties of metals (high rigidity, electrical conductivity) and engineering plastics (low density, electrical insulation). However, while many factors (metal parts, resins, mold structures, injection molding conditions) have had an adverse effect and prevent stable bonding, Polyplastics has made progress with successful bonding. For metal surface treatments, Polyplastics’ Quick-10 (R) technology uses quick heating and cooling of inserted metals to produce direct metal-resin bonding with metal insert molding alone, without any special surface treatments for the metal side. Resins must exhibit properties such as interface infinity, surface transferability (flowability), and low shrinkage to produce good bonding. A key resin component is an affinity improvement additive that gives the metal-resin interface improved compatibility and promotes maximum adhesion to the metal surface. Polypalstics’ metal adhesion grades include 1135MF1 and 940MA for PPS and PBT respectively. Other metal adhesion grades, 1150MF1 and 930MA, provide added functionality.

Polyplastics notes that mold temperature can have a strong effect on bonding. The company has devised optimum molding conditions to achieve good surface transferability and low mold shrinkage with a linear expansion rate close to that of metal. Metal-resin bonding technology has been used in mobile device parts (mobile phones, tablets, digital cameras) and some auto-related parts.

Polyplastics Co., Ltd. announced the launch of a new series of low-dielectric liquid crystal polymers (LCPs) for communication devices. LAPEROS (R) E420P is the first in a series of low-dielectric grades which also possess inherent high heat resistance, mechanical properties, chemical resistance, high flow, and low warpage for films and connectors in cabling, antennas and circuit boards. Polyplastics developed the new LCP series amidst increasing demand for low-dielectric and low-dielectric-tangent materials to satisfy the needs of 5G telecommunications and V2X telecommunications for autonomous automobiles and materials applicable for high-speed and high-frequency transmission components. LAPEROS (R) E420P makes use of an optimum combination of filler and formulation technology to achieve a low-dielectric constant of less than 3.0 measured perpendicular to the flow direction for the 1-20 GHz frequency band. Further, the dielectric loss tangent is stable over the entire frequency band. The material also fulfills downsizing requirements and increasingly complex designs in connector applications and can be used in surface-mount technology (SMT) processes. Polyplastics will expand its series of low-dielectric LCPs to meet broader performance requirements for connectors. The company plans to extend its product portfolio to include grades with enhanced low warpage, higher heat resistance and greater flow for compact, fine-pitched connectors. Since connectors are the primary target application, these grades are formulated with good flowability. Polyplastics reports that in tests using the company’s connector molds, the new grades are molded at lower packing pressure than conventional grades.